Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5606196 | High-frequency, high-density semiconductor chip package with screening bonding wires | Kyung S. Lee, Chan-Min Han | 1997-02-25 |
HL
Hai-Young Lee
Overall (1997): #145,093 of 185,788Top 80%
1
Patents 1997