Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5665639 | Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal | Bryan R. Seppala, Todd G. Backer | 1997-09-09 |
| 5621197 | Device for interrupting the flow of current in the positive or impregnated vehicle battery cable | Richard Bender, Christian Herget, Alfred Krappel, Robert Albiez, Maximilian Grobmair | 1997-04-15 |