Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5665639 | Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal | Bryan R. Seppala, Lothar Maier | 1997-09-09 |
| 5646804 | Thin film magnetic head having polymer on broken flux guide sections, method of producing and integrated structure incorporating same | Arthur Calderon, Wei C. Hsie, William P. Wood, Terry Mitchell | 1997-07-08 |