Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5665639 | Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal | Todd G. Backer, Lothar Maier | 1997-09-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5665639 | Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal | Todd G. Backer, Lothar Maier | 1997-09-09 |