Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5681423 | Semiconductor wafer for improved chemical-mechanical polishing over large area features | Gurtej S. Sandhu | 1997-10-28 |
| 5674352 | Process related to a modified polishing pad for polishing | Tat-Kwan Yu | 1997-10-07 |
| 5662788 | Method for forming a metallization layer | Gurtej S. Sandhu | 1997-09-02 |
| 5628862 | Polishing pad for chemical-mechanical polishing of a semiconductor substrate | Tat-Kwan Yu | 1997-05-13 |
| 5618381 | Multiple step method of chemical-mechanical polishing which minimizes dishing | Trung T. Doan | 1997-04-08 |