Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5683908 | Method of fabricating trench isolation structure having tapered opening | Koichi Takahashi | 1997-11-04 |
| 5643046 | Polishing method and apparatus for detecting a polishing end point of a semiconductor wafer | Ichiro Katakabe, Tatsuo Akiyama | 1997-07-01 |
| 5643406 | Chemical-mechanical polishing (CMP) method for controlling polishing rate using ionized water, and CMP apparatus | Mariko Shimomura, Hiroyuki Ohashi | 1997-07-01 |
| 5605488 | Polishing apparatus of semiconductor wafer | Hiroyuki Ohashi, Ichiro Katakabe, Tetsuya Tsukihara | 1997-02-25 |