Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5658828 | Method for forming an aluminum contact through an insulating layer | Fu-Tai Liou | 1997-08-19 |
| 5652464 | Integrated circuit with a titanium nitride contact barrier having oxygen stuffed grain boundaries | De-Dui Liao | 1997-07-29 |
| 5633534 | Integrated circuit with enhanced planarization | Alex Kalnitsky | 1997-05-27 |
| 5597983 | Process of removing polymers in semiconductor vias | Loi N. Nguyen | 1997-01-28 |