Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702979 | Method of forming a landing pad structure in an integrated circuit | Tsiu C. Chan, Frank R. Bryant | 1997-12-30 |
| 5597983 | Process of removing polymers in semiconductor vias | Yih-Shung Lin | 1997-01-28 |