Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5658828 | Method for forming an aluminum contact through an insulating layer | Yih-Shung Lin | 1997-08-19 |
| 5593921 | Method of forming vias | Fusen Chen, Girish Dixit | 1997-01-14 |
| 5594269 | Resistive load for integrated circuit devices | Charles R. Spinner, III | 1997-01-14 |