Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5693572 | Ball grid array integrated circuit package with high thermal conductivity | Michael J. Hundt | 1997-12-02 |
| 5642261 | Ball-grid-array integrated circuit package with solder-connected thermal conductor | Michael J. Hundt | 1997-06-24 |
| 5642265 | Ball grid array package with detachable module | Harry Michael Siegel | 1997-06-24 |