Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5693572 | Ball grid array integrated circuit package with high thermal conductivity | Robert H. Bond | 1997-12-02 |
| 5677247 | Low-profile socketed packaging system with land-grid array and thermally conductive slug | Anthony M. Chiu | 1997-10-14 |
| 5642261 | Ball-grid-array integrated circuit package with solder-connected thermal conductor | Robert H. Bond | 1997-06-24 |
| 5610800 | Substrate mounting of circuit components with a low profile | Harry Michael Siegel | 1997-03-11 |
| 5590462 | Process for dissipating heat from a semiconductor package | Carlo Cognetti | 1997-01-07 |