Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5642265 | Ball grid array package with detachable module | Robert H. Bond | 1997-06-24 |
| 5610800 | Substrate mounting of circuit components with a low profile | Michael J. Hundt | 1997-03-11 |