Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5368991 | Photosensitive resin composition for use as a light-shielding film which can be used as black matrices | Kiyoshi Uchikawa, Hiroshi Komano, Katsuyuki Ohta | 1994-11-29 |
| 5318651 | Method of bonding circuit boards | Koji Matsui, Mitsuru Kimura, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano | 1994-06-07 |