KU

Kazuaki Utsumi

NE Nec: 1 patents #206 of 1,007Top 25%
TC Tokyo Ohka Kogyo Co.: 1 patents #9 of 38Top 25%
Overall (1994): #107,346 of 165,921Top 65%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5318651 Method of bonding circuit boards Koji Matsui, Mitsuru Kimura, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama 1994-06-07