Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5372872 | Multilayer printed circuit board | Yoshitsugu Funada | 1994-12-13 |
| 5318651 | Method of bonding circuit boards | Mitsuru Kimura, Kazuaki Utsumi, Eiichi Ogawa, Hiroshi Komano, Toshimi Aoyama | 1994-06-07 |
| 5302456 | Anisotropic conductive material and method for connecting integrated circuit element by using the anisotropic conductive material | — | 1994-04-12 |
| 5287208 | Liquid crystal device with benzocyclobutene alignment layer and protective coating for electrodes | Tadanori Shimoto | 1994-02-15 |