Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5322207 | Method and apparatus for wire bonding semiconductor dice to a leadframe | Rich Fogal, Mike Ball | 1994-06-21 |
| 5302891 | Discrete die burn-in for non-packaged die | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Larry D. Kinsman | 1994-04-12 |