Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5350106 | Semiconductor wire bonding method | — | 1994-09-27 |
| 5322207 | Method and apparatus for wire bonding semiconductor dice to a leadframe | Chender Huang, Mike Ball | 1994-06-21 |
| 5323060 | Multichip module having a stacked chip arrangement | Michael Ball | 1994-06-21 |