Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5375320 | "Method of forming ""J"" leads on a semiconductor device" | Michael P. Grant, Gregory M. Chapman | 1994-12-27 |
| 5342807 | Soft bond for semiconductor dies | Derek Gochnour, Alan G. Wood, Warren M. Farnworth | 1994-08-30 |
| 5336649 | Removable adhesives for attachment of semiconductor dies | Derek Gochnour, Alan G. Wood, Warren M. Farnworth | 1994-08-09 |
| 5302891 | Discrete die burn-in for non-packaged die | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Chender Huang | 1994-04-12 |