Issued Patents 1994
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE34794 | Gull-wing zig-zag inline lead package having end-of-package anchoring pins | — | 1994-11-22 |
| 5367253 | Clamped carrier for testing of semiconductor dies | Alan G. Wood, David R. Hembree | 1994-11-22 |
| 5342807 | Soft bond for semiconductor dies | Larry D. Kinsman, Derek Gochnour, Alan G. Wood | 1994-08-30 |
| 5336649 | Removable adhesives for attachment of semiconductor dies | Larry D. Kinsman, Derek Gochnour, Alan G. Wood | 1994-08-09 |
| 5326428 | Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability | Malcolm Grief, Gurtej S. Sandhu | 1994-07-05 |
| 5304842 | Dissimilar adhesive die attach for semiconductor devices | Rockwell Smith, Walter L. Moden | 1994-04-19 |
| 5286679 | Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer | Ed A. Shrock, Scott Clifford, Jerrold L. King, Walter L. Moden | 1994-02-15 |