Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5367196 | Molded plastic semiconductor package including an aluminum alloy heat spreader | Deepak Mahulikar, Szuchain Chen | 1994-11-22 |
| 5324888 | Metal electronic package with reduced seal width | Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Paul R. Hoffman | 1994-06-28 |