Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5360942 | Multi-chip electronic package module utilizing an adhesive sheet | Dexin Liang | 1994-11-01 |
| 5324888 | Metal electronic package with reduced seal width | Derek E. Tyler, Deepak Mahulikar, Anthony M. Pasqualoni, Jeffrey S. Braden | 1994-06-28 |