Issued Patents 1994
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5367196 | Molded plastic semiconductor package including an aluminum alloy heat spreader | Jeffrey S. Braden, Szuchain Chen | 1994-11-22 |
| 5343073 | Lead frames having a chromium and zinc alloy coating | Arvind Parthasarathi | 1994-08-30 |
| 5324888 | Metal electronic package with reduced seal width | Derek E. Tyler, Anthony M. Pasqualoni, Jeffrey S. Braden, Paul R. Hoffman | 1994-06-28 |
| 5320689 | Surface modified copper alloys | Brian Mravic | 1994-06-14 |
| 5315155 | Electronic package with stress relief channel | Brian E. O'Donnelly, Brian Mravic, Jacob Crane | 1994-05-24 |