Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366933 | Method for constructing a dual sided, wire bonded integrated circuit chip package | Richard Foehringer, Michael Wentling, Ryo Takatsuki, Shigeo Kawashima | 1994-11-22 |
| 5336456 | Method of producing a scribelined layout structure for plastic encapsulated circuits | Steven Eskildsen, Tito Barrios | 1994-08-09 |