MW

Michael Wentling

IN Intel: 1 patents #87 of 367Top 25%
📍 Cameron Park, CA: #6 of 25 inventorsTop 25%
🗺 California: #3,049 of 13,957 inventorsTop 25%
Overall (1994): #89,204 of 165,921Top 55%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5366933 Method for constructing a dual sided, wire bonded integrated circuit chip package Suresh Golwalkar, Richard Foehringer, Ryo Takatsuki, Shigeo Kawashima 1994-11-22