Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366933 | Method for constructing a dual sided, wire bonded integrated circuit chip package | Suresh Golwalkar, Richard Foehringer, Michael Wentling, Shigeo Kawashima | 1994-11-22 |