Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334361 | Substrate structure, and fabrication and packaging methods thereof | Peng Chen, Houde Zhou | 2025-06-17 |
| 12205940 | Semiconductor package structure and packaging method thereof | Peng Chen, Houde Zhou | 2025-01-21 |
| 12166012 | Flip-chip stacking structures and methods for forming the same | Peng Chen, Meng Wang, Baohua Zhang, Houde Zhou | 2024-12-10 |
| 12125827 | Chip package structure and manufacturing method thereof | Peng Chen, Houde Zhou | 2024-10-22 |
| 11721686 | Semiconductor package structure and packaging method thereof | Peng Chen, Houde Zhou | 2023-08-08 |
| 11694904 | Substrate structure, and fabrication and packaging methods thereof | Peng Chen, Houde Zhou | 2023-07-04 |
| 11688721 | Chip package structure and manufacturing method thereof | Peng Chen, Houde Zhou | 2023-06-27 |
| 11133290 | Chip package structure with stacked chips and manufacturing method thereof | Peng Chen, Houde Zhou | 2021-09-28 |