Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334361 | Substrate structure, and fabrication and packaging methods thereof | Xinru Zeng, Houde Zhou | 2025-06-17 |
| 12234398 | Metal organic framework (MOF) glass composite comprising metal halide perovskite | Jingwei HOU, Vicki Chen, Lianzhou Wang, Thomas D. Bennett | 2025-02-25 |
| 12224366 | Manufacturing method and manufacturing apparatus for interconnection member | Hua Li, Yong Wang, Debao ZHAO, Jun-Wei Chen, Jiyu Liu | 2025-02-11 |
| 12205940 | Semiconductor package structure and packaging method thereof | Houde Zhou, Xinru Zeng | 2025-01-21 |
| 12187646 | Synchronous single-liquid grouting slurry, its technology and application for large diameter shield engineering under water-rich, high-pressure and weak soil strata conditions | Fei Sha, Jian-Ying Chen, Zhe Zhang, Jianyong Zhang, Shutong Yang +13 more | 2025-01-07 |
| 12166012 | Flip-chip stacking structures and methods for forming the same | Xinru Zeng, Meng Wang, Baohua Zhang, Houde Zhou | 2024-12-10 |
| 12131924 | Method for processing semiconductor wafers | Liquan Cai, Houde Zhou | 2024-10-29 |
| 12125827 | Chip package structure and manufacturing method thereof | Xinru Zeng, Houde Zhou | 2024-10-22 |
| 12121995 | Laser system for dicing semiconductor structure and operation method thereof | Liquan Cai, Houde Zhou | 2024-10-22 |
| 12106985 | Laser dicing system and method for dicing semiconductor structure including cutting street | Liquan Cai, Houde Zhou | 2024-10-01 |
| 11866332 | Carbon nanoparticle-porous skeleton composite material, its composite with lithium metal, and their preparation methods and use | Feng Guo, Yalong WANG, Tuo Kang, Chenghao Liu, Yanbin Shen +2 more | 2024-01-09 |
| 11721686 | Semiconductor package structure and packaging method thereof | Houde Zhou, Xinru Zeng | 2023-08-08 |
| 11694918 | Method and device for wafer taping | Mingliang Li, Jian Miao | 2023-07-04 |
| 11694904 | Substrate structure, and fabrication and packaging methods thereof | Xinru Zeng, Houde Zhou | 2023-07-04 |
| 11688721 | Chip package structure and manufacturing method thereof | Xinru Zeng, Houde Zhou | 2023-06-27 |
| 11476173 | Manufacturing method of integrated circuit packaging structure | Houde Zhou, Baohua Zhang, Chao Gu | 2022-10-18 |
| 11469153 | Electronic component comprising substrate with thermal indicator | Houde Zhou, Chao Gu | 2022-10-11 |
| 11462741 | Metallic lithium-skeleton carbon composite material having a hydrophobic cladding layer, preparation method and use thereof | Tuo Kang, Liwei Chen, Wei Lu, Yanbin Shen, Yalong WANG +2 more | 2022-10-04 |
| 11339849 | Three-dimensional isolator with adaptive stiffness property | Ying Zhou | 2022-05-24 |
| 11232969 | Method and device for wafer taping | Mingliang Li, Jian Miao | 2022-01-25 |
| 11133290 | Chip package structure with stacked chips and manufacturing method thereof | Xinru Zeng, Houde Zhou | 2021-09-28 |
| 9276254 | Method for removing burrs of battery electrode plates by inductively coupled plasma dry etching | Rong Zhang, Ting Zhi, Tao Tao, Zhili Xie, Zhiguo Yu +6 more | 2016-03-01 |
| 8765632 | Process for preparing catalyst comprising palladium supported on carrier with high dispersion | Fazhi Zhang, Rong Hou, Jiali Chen, Chao Gao, Hui Zhang +3 more | 2014-07-01 |
| 8420407 | Growth method of Fe3N material | Rong Zhang, Zili Xie, Bin Liu, Xiangqian Xiu, Henan Fang +4 more | 2013-04-16 |
| 6455615 | Flexible polymer modified cement-based waterproofing materials and their making process | Ji Guang Yu, Dong Xia, Lei Zhu, Yu Guo | 2002-09-24 |