| 12334361 |
Substrate structure, and fabrication and packaging methods thereof |
Xinru Zeng, Peng Chen |
2025-06-17 |
| 12205940 |
Semiconductor package structure and packaging method thereof |
Peng Chen, Xinru Zeng |
2025-01-21 |
| 12166012 |
Flip-chip stacking structures and methods for forming the same |
Xinru Zeng, Peng Chen, Meng Wang, Baohua Zhang |
2024-12-10 |
| 12131924 |
Method for processing semiconductor wafers |
Liquan Cai, Peng Chen |
2024-10-29 |
| 12121995 |
Laser system for dicing semiconductor structure and operation method thereof |
Liquan Cai, Peng Chen |
2024-10-22 |
| 12125827 |
Chip package structure and manufacturing method thereof |
Xinru Zeng, Peng Chen |
2024-10-22 |
| 12106985 |
Laser dicing system and method for dicing semiconductor structure including cutting street |
Liquan Cai, Peng Chen |
2024-10-01 |
| 11721686 |
Semiconductor package structure and packaging method thereof |
Peng Chen, Xinru Zeng |
2023-08-08 |
| 11694904 |
Substrate structure, and fabrication and packaging methods thereof |
Xinru Zeng, Peng Chen |
2023-07-04 |
| 11688721 |
Chip package structure and manufacturing method thereof |
Xinru Zeng, Peng Chen |
2023-06-27 |
| 11476173 |
Manufacturing method of integrated circuit packaging structure |
Peng Chen, Baohua Zhang, Chao Gu |
2022-10-18 |
| 11469153 |
Electronic component comprising substrate with thermal indicator |
Peng Chen, Chao Gu |
2022-10-11 |
| 11133290 |
Chip package structure with stacked chips and manufacturing method thereof |
Xinru Zeng, Peng Chen |
2021-09-28 |