Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8237221 | Semiconductor device and method of manufacturing semiconductor device | Ryotaro Yagi, Isamu Nishimura | 2012-08-07 |
| 8164160 | Semiconductor device | Yuichi Nakao | 2012-04-24 |
| 8125084 | Semiconductor device and semiconductor device manufacturing method | Ryosuke Nakagawa, Yuichi Nakao, Katsumi Sameshima, Satoshi Kageyama | 2012-02-28 |
| 8022472 | Semiconductor device and method of manufacturing semiconductor device | Ryotaro Yagi, Isamu Nishimura | 2011-09-20 |
| 7211902 | Method of forming a bonding pad structure | — | 2007-05-01 |
| 7067928 | Method of forming a bonding pad structure | — | 2006-06-27 |
| 6921714 | Method for manufacturing a semiconductor device | — | 2005-07-26 |
| 6888183 | Manufacture method for semiconductor device with small variation in MOS threshold voltage | — | 2005-05-03 |
| 6555465 | Multi-layer wiring structure of integrated circuit and manufacture of multi-layer wiring | — | 2003-04-29 |
| 6541373 | Manufacture method for semiconductor with small variation in MOS threshold voltage | — | 2003-04-01 |
| 6297563 | Bonding pad structure of semiconductor device | — | 2001-10-02 |
| 6251805 | Method of fabricating semiconductor device | Yushi Inoue | 2001-06-26 |
| 6150720 | Semiconductor device having manufacturing wiring structure with buried plugs | Tetsuya Kuwajima | 2000-11-21 |
| 6146998 | Method of manufacturing wiring structure having buried plugs in semiconductor device, and semiconductor device | Tetsuya Kuwajima | 2000-11-14 |
| 6080652 | Method of fabricating a semiconductor device having a multi-layered wiring | Seiji Hirade | 2000-06-27 |
| 6060390 | Method of forming wiring layer | Masaru Naito | 2000-05-09 |
| 5997754 | Method of fabricating multi-layered wiring | Masaru Naito | 1999-12-07 |
| 5998814 | Semiconductor device and fabrication method thereof | Seiji Hirade | 1999-12-07 |
| 5904576 | Method of forming wiring structure | Yushi Inoue | 1999-05-18 |
| 5885857 | Semiconductor chip capable of suppressing cracks in the insulating layer | Yushi Inoue, Masaru Naito | 1999-03-23 |
| 5821162 | Method of forming multi-layer wiring utilizing SOG | Yushi Inoue | 1998-10-13 |
| 5793110 | MOS transistor with good hot carrier resistance and low interface state density | Seiji Hirade | 1998-08-11 |
| 5786638 | Semiconductor device with moisture impervious film | — | 1998-07-28 |
| 5786625 | Moisture resistant semiconductor device | — | 1998-07-28 |
| 5763936 | Semiconductor chip capable of supressing cracks in insulating layer | Yushi Inoue, Masaru Naito | 1998-06-09 |