Issued Patents All Time
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5750403 | Method of forming multi-layer wiring utilizing hydrogen silsesquioxane resin | Yushi Inoue | 1998-05-12 |
| 5733797 | Method of making a semiconductor device with moisture impervious film | — | 1998-03-31 |
| 5716869 | Method of forming a wiring layer of a semiconductor device using reflow process | Satoshi Hibino | 1998-02-10 |
| 5705429 | Method of manufacturing aluminum wiring at a substrate temperature from 100 to 150 degrees celsius | Satoshi Hibino, Masaru Naito | 1998-01-06 |
| 5641993 | Semiconductor IC with multilayered Al wiring | Masaru Naito | 1997-06-24 |
| 5629557 | Semiconductor device capable of preventing humidity invasion | — | 1997-05-13 |
| 5593925 | Semiconductor device capable of preventing humidity invasion | — | 1997-01-14 |
| 5428251 | Multi-layer wiring structure having continuous grain boundaries | Masaru Naito | 1995-06-27 |
| 5036382 | Semiconductor device having a multi-level wiring structure | — | 1991-07-30 |