Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824887 | Nitride semiconductor device | Yoshimi Tanimoto, Koichiro Fujita, Takao Kinoshita | 2017-11-21 |
| 9660068 | Nitride semiconductor | Atsushi Ogawa, Nobuyuki Ito, Nobuaki Teraguchi | 2017-05-23 |
| 9449951 | Semiconductor device | Yukitoshi Hirose, Shiro Harashima, Takuya Moriya, Chihoko Yokobe | 2016-09-20 |
| 9159664 | Semiconductor device | Yukitoshi Hirose | 2015-10-13 |
| 8937392 | Semiconductor device | Yukitoshi Hirose, Shiro Harashima, Takuya Moriya, Chihoko Yokobe | 2015-01-20 |
| 8530877 | Non-volatile semiconductor device | Junya Onishi, Shinobu Yamazaki, Kazuya Ishihara, Yukio Tamai, Nobuyoshi Awaya | 2013-09-10 |
| 8450145 | Nonvolatile semiconductor memory device and method for producing the same | — | 2013-05-28 |
| 7615459 | Manufacturing method for variable resistive element | Tetsuya Ohnishi, Kazuya Ishihara, Takahiro Shibiuya, Yasunari Hosoi, Shinobu Yamazaki +1 more | 2009-11-10 |
| 7402513 | Method for forming interlayer insulation film | Takanori Sonoda, Kazumasa Mitsumune, Kenichiroh Abe, Tsukasa Doi | 2008-07-22 |
| 6841467 | Method for producing semiconductor device | — | 2005-01-11 |
| 6828604 | Semiconductor device with antenna pattern for reducing plasma damage | — | 2004-12-07 |
| 6503849 | Method for forming insulating film | Yoshihiro Ooishi | 2003-01-07 |
| 6251805 | Method of fabricating semiconductor device | Takahisa Yamaha | 2001-06-26 |
| 5976966 | Converting a hydrogen silsesquioxane film to an oxide using a first heat treatment and a second heat treatment with the second heat treatment using rapid thermal processing | — | 1999-11-02 |
| 5940734 | Method of fabricating a wiring on a planarized surface | — | 1999-08-17 |
| 5904576 | Method of forming wiring structure | Takahisa Yamaha | 1999-05-18 |
| 5885857 | Semiconductor chip capable of suppressing cracks in the insulating layer | Takahisa Yamaha, Masaru Naito | 1999-03-23 |
| 5821162 | Method of forming multi-layer wiring utilizing SOG | Takahisa Yamaha | 1998-10-13 |
| 5763936 | Semiconductor chip capable of supressing cracks in insulating layer | Takahisa Yamaha, Masaru Naito | 1998-06-09 |
| 5750403 | Method of forming multi-layer wiring utilizing hydrogen silsesquioxane resin | Takahisa Yamaha | 1998-05-12 |