| 8368002 |
In-line image sensor in combination with linear variable filter based spectrophotometer |
Paul A. Hosier, Jagdish C. Tandon, Paul S. Bonino |
2013-02-05 |
$1,495,000 |
| 6998595 |
Color filter configuration for a silicon wafer to be diced into photosensitive chips |
Paul A. Hosier, Thomas Grimsley |
2006-02-14 |
$6,071,000 |
| 6955989 |
Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon |
Alain E. Perregaux, Paul A. Hosier, Nicholas J. Salatino, Jagdish C. Tandon |
2005-10-18 |
$7,049,000 |
| 6927381 |
Photosensitive imaging apparatus sensitive to orange light |
Paul A. Hosier, Jagdish C. Tandon, Gaurav Sharma, Alain E. Perregaux, Robert P. Herloski |
2005-08-09 |
$9,575,000 |
| 6768565 |
Infrared correction in color scanners |
Alain E. Perregaux |
2004-07-27 |
$6,077,000 |
| 6646248 |
Photosensitive imaging apparatus sensitive to orange light |
Paul A. Hosier, Jagdish C. Tandon, Gaurav Sharma, Alain E. Perregaux, Robert P. Herloski |
2003-11-11 |
$3,152,000 |
| 6316284 |
Infrared correction in color scanners |
Alain E. Perregaux |
2001-11-13 |
$7,835,000 |
| 6266438 |
Architecture for color space transformation to compensate for relative chip-to-chip spectral variations on a butted full-width array sensor bar |
David J. Metcalfe, Dawn Williams-Fuller, Joseph P. Taillie |
2001-07-24 |
$8,064,000 |
| 6255133 |
Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same |
Brian T. Ormond, Thomas Grimsley, Paul A. Hosier |
2001-07-03 |
$12,549,000 |
| 6252220 |
Sensor cover glass with infrared filter |
Debra S. Vent |
2001-06-26 |
$5,873,000 |
| 6222180 |
Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same |
Brian T. Ormond, Thomas Grimsley |
2001-04-24 |
$8,987,000 |
| 6201293 |
Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same |
Brian T. Ormond, Thomas Grimsley, Paul A. Hosier |
2001-03-13 |
$4,387,000 |
| 6198093 |
Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same |
Brian T. Ormond, Thomas Grimsley |
2001-03-06 |
$5,491,000 |
| 6165813 |
Replacing semiconductor chips in a full-width chip array |
Kraig A. Quinn, Brian T. Ormond |
2000-12-26 |
$2,906,000 |
| 5808297 |
Reflective test patches for translucent color filters in photosensitive semiconductor chips |
Brian T. Ormond |
1998-09-15 |
$8,138,000 |
| 5753959 |
Replacing semiconductor chips in a full-width chip array |
Kraig A. Quinn, Brian T. Ormond |
1998-05-19 |
$12,279,000 |
| 5696626 |
Photosensitive silicon chip having a ridge near an end photosite |
Paul A. Hosier, Jagdish C. Tandon, Brian T. Ormond |
1997-12-09 |
$7,807,000 |
| 5604362 |
Filter architecture for a photosensitive chip |
Brian T. Ormond, Debra S. Vent |
1997-02-18 |
$11,012,000 |
| 5545913 |
Assembly for mounting semiconductor chips in a full-width-array image scanner |
Kraig A. Quinn, Brian T. Ormond |
1996-08-13 |
$13,434,000 |
| 5521125 |
Precision dicing of silicon chips from a wafer |
Brian T. Ormond |
1996-05-28 |
$4,679,000 |
| 5219796 |
Method of fabricating image sensor dies and the like for use in assembling arrays |
Kraig A. Quinn, Brian T. Ormond |
1993-06-15 |
$3,210,000 |
| 5128282 |
Process for separating image sensor dies and the like from a wafer that minimizes silicon waste |
Brian T. Ormond, Kraig A. Quinn, Paul A. Hosier |
1992-07-07 |
$2,828,000 |
| 5119181 |
Color array for use in fabricating full width arrays |
Alain E. Perregaux, Jagdish C. Tandon, Stephen C. Corona |
1992-06-02 |
$2,477,000 |
| 5031032 |
Color array for use in fabricating full width arrays |
Alain E. Perregaux, Jagdish C. Tandon |
1991-07-09 |
$2,612,000 |
| 4954197 |
Process for assembling smaller arrays together to form a longer array |
Ewart O. LeBlanc, Judith A. Masseth |
1990-09-04 |
$5,227,000 |
