Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8129258 | Method for dicing a semiconductor wafer, a chip diced from a semiconductor wafer, and an array of chips diced from a semiconductor wafer | Paul A. Hosier | 2012-03-06 |
| 6955989 | Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon | Alain E. Perregaux, Paul A. Hosier, Josef E. Jedlicka, Jagdish C. Tandon | 2005-10-18 |
| 6291317 | Method for dicing of micro devices | John C. Ackerman | 2001-09-18 |