Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600671 | Micro-transfer-printable flip-chip structures and methods | Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Carl Prevatte | 2020-03-24 |
| 10593827 | Device source wafers with patterned dissociation interfaces | Christopher Bower, Matthew Meitl, Ronald S. Cok | 2020-03-17 |
| 10510937 | Interconnection by lateral transfer printing | Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Christopher Bower +1 more | 2019-12-17 |
| 10505079 | Flexible devices and methods using laser lift-off | Christopher Bower, Ronald S. Cok, Matthew Meitl | 2019-12-10 |
| 10453826 | Voltage-balanced serial iLED pixel and display | Ronald S. Cok, Matthew Meitl | 2019-10-22 |
| 10431487 | Micro-transfer-printable flip-chip structures and methods | Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Carl Prevatte | 2019-10-01 |
| 10395966 | Micro-transfer-printable flip-chip structures and methods | Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Carl Prevatte | 2019-08-27 |
| 10332868 | Stacked pixel structures | Ronald S. Cok, Christopher Bower | 2019-06-25 |
| 10224231 | Micro-transfer-printable flip-chip structures and methods | Christopher Bower, Matthew Meitl, António José Marques Trindade, Ronald S. Cok, Carl Prevatte | 2019-03-05 |
| 6541301 | Low RF loss direct die attach process and apparatus | — | 2003-04-01 |
| 5378926 | Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes | Tom Chi | 1995-01-03 |
| 5156998 | Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes | Tom Chi | 1992-10-20 |