Issued Patents All Time
Showing 201–222 of 222 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9434150 | Apparatus and methods for micro-transfer-printing | Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg | 2016-09-06 |
| 9437782 | Micro assembled LED displays and lighting elements | Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru +1 more | 2016-09-06 |
| 9401344 | Substrates with transferable chiplets | Joseph Carr | 2016-07-26 |
| 9358775 | Apparatus and methods for micro-transfer-printing | Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg | 2016-06-07 |
| 9355854 | Methods of fabricating printable compound semiconductor devices on release layers | Matthew Meitl, Etienne Menard, James Thomas Carter, Allen Gray, Salvatore Bonafede | 2016-05-31 |
| 9343363 | Through-silicon vias and interposers formed by metal-catalyzed wet etching | Matthew Meitl | 2016-05-17 |
| 9307652 | Methods for surface attachment of flipped active components | — | 2016-04-05 |
| 9165989 | High-yield fabrication of large-format substrates with distributed, independent control elements | Etienne Menard, John W. Hamer, Ronald S. Cok | 2015-10-20 |
| 9142468 | Structures and methods for testing printable integrated circuits | Etienne Menard, Matthew Meitl | 2015-09-22 |
| 9049797 | Electrically bonded arrays of transfer printed active components | Etienne Menard, Matthew Meitl, Philip E. Garrou | 2015-06-02 |
| 9040425 | Methods of forming printable integrated circuit devices and devices formed thereby | Etienne Menard, Matthew Meitl, Joseph Carr | 2015-05-26 |
| 8975753 | Three dimensional interconnect structure and method thereof | Charles Kenneth Williams, Dean M. Malta, Dorota Temple | 2015-03-10 |
| 8934259 | Substrates with transferable chiplets | Joseph Carr | 2015-01-13 |
| 8889485 | Methods for surface attachment of flipped active componenets | — | 2014-11-18 |
| 8877648 | Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby | Etienne Menard, Matthew Meitl | 2014-11-04 |
| 8866081 | High density faraday cup array or other open trench structures and method of manufacture thereof | Kristin Hedgepath Gilchrist, Brian R. Stoner | 2014-10-21 |
| 8866080 | Faraday cup array integrated with a readout IC and method for manufacture thereof | Kristin Hedgepath Gilchrist, Brian R. Stoner, Dorota Temple | 2014-10-21 |
| 8486765 | Structure and process for electrical interconnect and thermal management | Philip E. Garrou, Charles Kenneth Williams | 2013-07-16 |
| 8035223 | Structure and process for electrical interconnect and thermal management | Philip E. Garrou, Charles Kenneth Williams | 2011-10-11 |
| 7999454 | OLED device with embedded chip driving | Dustin L. Winters, John W. Hamer, Gary Parrett, Etienne Menard | 2011-08-16 |
| 6630772 | Device comprising carbon nanotube field emitter structure and process for forming device | Otto Z. Zhou, Wei Zhu | 2003-10-07 |
| 6277318 | Method for fabrication of patterned carbon nanotube films | Otto Z. Zhou, Wei Zhu | 2001-08-21 |