Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6554686 | Sawing wire and method for the cutting and lapping of hard brittle workpieces | Maximilian Kaeser | 2003-04-29 |
| 6295977 | Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece | Bert Ripper, Karl Egglhuber, Holger Lundt, Helmut Kolker, Jochen Greim | 2001-10-02 |
| 6159284 | Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers | Hans Olkrug, Holger Lundt, Josef Frumm | 2000-12-12 |