Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8844511 | Method for slicing a multiplicity of wafers from a crystal composed of semiconductor material | Albert Blank | 2014-09-30 |
| 6554686 | Sawing wire and method for the cutting and lapping of hard brittle workpieces | Christian Andrae | 2003-04-29 |
| 5947102 | Method for cutting wafers from a crystal | Vernon E. Knepprath, Walter Frank, Albert Pemwieser | 1999-09-07 |