HL

Holger Lundt

SA Siltronic Ag: 1 patents #145 of 300Top 50%
WA Wacker Chemie Ag: 1 patents #641 of 1,324Top 50%
Overall (All Time): #879,038 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
6773333 Method for cutting slices from a workpiece Lothar Huber, Peter Wiesner 2004-08-10
6362487 Method and device for nondestructive detection of crystal defects Andreas Ehlert, Michael Kerstan, Dieter Helmreich 2002-03-26
6295977 Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece Bert Ripper, Christian Andrae, Karl Egglhuber, Helmut Kolker, Jochen Greim 2001-10-02
6159284 Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers Hans Olkrug, Christian Andrae, Josef Frumm 2000-12-12
6129609 Method for achieving a wear performance which is as linear as possible and tool having a wear performance which is as linear as possible Bert Ripper, Robert Hofmann, Peter Lehfeld 2000-10-10
5741173 Method and apparatus for machining semiconductor material Karl Kobler, Hanifi Malcok 1998-04-21