Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5332864 | Integrated circuit package having an interposer | Sang S. Lee, Young I. Kwon | 1994-07-26 |
| 5296744 | Lead frame assembly and method for wiring same | Sang S. Lee | 1994-03-22 |
| 5233131 | Integrated circuit die-to-leadframe interconnect assembly system | Jon M. Long | 1993-08-03 |
| 5218215 | Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path | Jon M. Long | 1993-06-08 |
| 5171712 | Method of constructing termination electrodes on yielded semiconductor die by visibly aligning the die pads through a transparent substrate | Tsing-Chow Wang | 1992-12-15 |