JF

Jackie Fu

VT Via Technologies: 2 patents #343 of 1,108Top 35%
Overall (All Time): #2,193,987 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6779783 Method and structure for tape ball grid array package Chen-Yueh Kung, Kwun-Yao Ho 2004-08-24
6569712 Structure of a ball-grid array package substrate and processes for producing thereof Kwun-Yao Ho, Moriss Kung, Lin-Chou Tung 2003-05-27