Issued Patents All Time
Showing 26–50 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6057573 | Design for high density memory with relaxed metal pitch | Howard C. Kirsch | 2000-05-02 |
| 5976945 | Method for fabricating a DRAM cell structure on an SOI wafer incorporating a two dimensional trench capacitor | Min-hwa Chi | 1999-11-02 |
| 5943581 | Method of fabricating a buried reservoir capacitor structure for high-density dynamic random access memory (DRAM) circuits | Janmye Sung | 1999-08-24 |
| 5933725 | Word line resistance reduction method and design for high density memory with relaxed metal pitch | Howard C. Kirsch | 1999-08-03 |
| 5930661 | Substrate clamp design for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers | — | 1999-07-27 |
| 5843820 | Method of fabricating a new dynamic random access memory (DRAM) cell having a buried horizontal trench capacitor | — | 1998-12-01 |
| 5827394 | Step and repeat exposure method for loosening integrated circuit dice from a radiation sensitive adhesive tape backing | — | 1998-10-27 |
| 5821142 | Method for forming a capacitor with a multiple pillar structure | Janmye Sung, Howard C. Kirsch | 1998-10-13 |
| 5804480 | method for forming a DRAM capacitor using HSG-Si technique and oxygen implant | Horng-Huei Tseng | 1998-09-08 |
| 5792680 | Method of forming a low cost DRAM cell with self aligned twin tub CMOS devices and a pillar shaped capacitor | Janmye Sung, Howard C. Kirsch | 1998-08-11 |
| 5789316 | Self-aligned method for forming a narrow via | — | 1998-08-04 |
| 5759894 | Method for forming a DRAM capacitor using HSG-Si | Horng-Huei Tseng | 1998-06-02 |
| 5679596 | Spot deposited polysilicon for the fabrication of high capacitance, DRAM devices | — | 1997-10-21 |
| 5679589 | FET with gate spacer | Kuo-Hua Lee, Janmye Sung | 1997-10-21 |
| 5663093 | Method for forming a cylindrical capacitor having a central spine | Horng-Huei Tseng | 1997-09-02 |
| 5652165 | Method of forming a stacked capacitor with a double wall crown shape | Horng-Huei Tseng | 1997-07-29 |
| 5631480 | DRAM stack capacitor with ladder storage node | Horng-Huei Tseng | 1997-05-20 |
| 5595928 | High density dynamic random access memory cell structure having a polysilicon pillar capacitor | Horng-Huei Tseng | 1997-01-21 |
| 5594682 | High density self-aligned stack in trench DRAM technology | Horng-Huei Tseng | 1997-01-14 |
| 5552620 | Vertical transistor with high density DRAM cell and method of making | Horng-Huei Tseng | 1996-09-03 |
| 5550077 | DRAM cell with a comb-type capacitor | Horng-Huei Tseng | 1996-08-27 |
| 5534457 | "Method of forming a stacked capacitor with an ""I"" shaped storage node" | Horng-Huei Tseng | 1996-07-09 |
| 5534460 | Optimized contact plug process | Horng-Huei Tseng | 1996-07-09 |
| 5519238 | Rippled polysilicon surface capacitor electrode plate for high density dram | — | 1996-05-21 |
| 5451537 | Method of forming a DRAM stack capacitor with ladder storage node | Horng-Huei Tseng | 1995-09-19 |