Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11883869 | Butt retrieval system | Kenneth James Platt, Joseph Vasalani | 2024-01-30 |
| 11641810 | System for providing circulating air for a vertical gardening system | Matthew Lawrence Bogner | 2023-05-09 |
| 11632915 | System for providing circulating air for a vertical gardening system | Matthew Lawrence Bogner | 2023-04-25 |
| 10806099 | System and method for providing carbon dioxide and circulating air for a vertical gardening system | Matthew Lawrence Bogner | 2020-10-20 |
| D873036 | Hanger | Matthew Lawrence Bogner | 2020-01-21 |
| 8315525 | Amplification of interleaved optical signals | — | 2012-11-20 |
| 8295706 | Technique for simultaneously transmitting wide and narrow optical beacon signals | David R. Wickholm, Dean S. Grinch, Daniel L. Baber | 2012-10-23 |
| RE41538 | Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby | — | 2010-08-17 |
| 7609972 | Acquisition, pointing, and tracking architecture for laser communication | Dean S. Grinch, Donald Fisher | 2009-10-27 |
| 7585766 | Methods of manufacturing copper interconnect systems | — | 2009-09-08 |
| 7385982 | Systems and methods for providing quality of service (QoS) in an environment that does not normally support QoS features | Gary G. Warden, Nathan A. Kragick | 2008-06-10 |
| 7372152 | Copper interconnect systems | — | 2008-05-13 |
| 7361589 | Copper interconnect systems which use conductive, metal-based cap layers | — | 2008-04-22 |
| 7351655 | Copper interconnect systems which use conductive, metal-based cap layers | — | 2008-04-01 |
| 7026714 | Copper interconnect systems which use conductive, metal-based cap layers | — | 2006-04-11 |
| 6551872 | Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby | — | 2003-04-22 |
| 6521532 | Method for making integrated circuit including interconnects with enhanced electromigration resistance | — | 2003-02-18 |
| 6494495 | Locked connection | — | 2002-12-17 |
| 6479362 | Semiconductor device with high-temperature-stable gate electrode for sub-micron applications and fabrication thereof | — | 2002-11-12 |
| 6455937 | Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects | — | 2002-09-24 |
| 6441492 | Diffusion barriers for copper interconnect systems | — | 2002-08-27 |
| 6368918 | Method of fabricating Nan embedded flash EEPROM with a tunnel oxide grown on a textured substrate | Richard A. Blanchard | 2002-04-09 |
| 6293517 | Ball valve having convex seat | — | 2001-09-25 |
| 6272050 | Method and apparatus for providing an embedded flash-EEPROM technology | Richard A. Blanchard | 2001-08-07 |
| 6208004 | Semiconductor device with high-temperature-stable gate electrode for sub-micron applications and fabrication thereof | — | 2001-03-27 |