Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper interconnect systems which use conductive, metal-based cap layers

Copper interconnect systems which use conductive, metal-based cap layers

US Patent 7351655 · Granted Apr 1, 2008

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Butt retrieval system2024
System for providing circulating air for a vertical gardening system2023
System for providing circulating air for a vertical gardening system2023
System and method for providing carbon dioxide and circulating air for a vertica2020
Hanger2020
Amplification of interleaved optical signals2012
Technique for simultaneously transmitting wide and narrow optical beacon signals2012
Method for making integrated circuit including interconnects with enhanced elect2010
Acquisition, pointing, and tracking architecture for laser communication2009
Methods of manufacturing copper interconnect systems2009
Systems and methods for providing quality of service (QoS) in an environment tha2008
Copper interconnect systems2008