Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759218 | Chemical mechanical polishing process | Boon-Tiong Neo, Chin-Kun Lin | 2014-06-24 |
| 8129278 | Chemical mechanical polishing process | Boon-Tiong Neo, Chin-Kun Lin | 2012-03-06 |
| 7004820 | CMP method and device capable of avoiding slurry residues | Ching-Wen Teng, Ming-Hsing Kao, Chin-Kun Lin, Er-Yang Chua | 2006-02-28 |