| 6376382 |
Method for forming an opening |
Hsiao-Pang Chou |
2002-04-23 |
| 6277727 |
Method of forming a landing pad on a semiconductor wafer |
Chien-Li Kuo |
2001-08-21 |
| 6277685 |
Method of forming a node contact hole on a semiconductor wafer |
Benjamin Szu-Min Lin, Chin-Hui Lee, Chuan-Fu Wang |
2001-08-21 |
| 6251725 |
Method of fabricating a DRAM storage node on a semiconductor wafer |
Te-Yuan Wu, Chuan-Fu Wang |
2001-06-26 |
| 6214747 |
Method for forming opening in a semiconductor device |
Hsiao-Pang Chou |
2001-04-10 |
| 6204117 |
Removal of silicon oxynitride on a capacitor electrode for selective hemispherical grain growth |
Chuan-Fu Wang |
2001-03-20 |
| 6197700 |
Fabrication method for bottom electrode of capacitor |
Chuan-Fu Wang |
2001-03-06 |
| 6190956 |
Forming a capacitor structure of a semiconductor |
Jhy-Jyi Sze |
2001-02-20 |
| 6187669 |
Method of forming a node contact of a DRAM's memory cell |
Benjamin Szu-Min Lin |
2001-02-13 |
| 6171903 |
Method for forming a cylinder-shaped capacitor using a dielectric mask |
— |
2001-01-09 |
| 6060401 |
Method of fabricating dual cylindrical capacitor |
King-Lung Wu |
2000-05-09 |