Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916416 | Semiconductor wafer with modified surface and fabrication method thereof | Yao-Wen Hsu, Po-Jen Wang, Tsung-Han Tsai | 2021-02-09 |
| 10868116 | Circuit structure and method for reducing electronic noises | Chi-Feng Huang, Fu-Huan Tsai, Victor Chiang Liang | 2020-12-15 |
| 10804211 | Semiconductor structure and fabricating method thereof | Kuo-Hung Lee, Chih-Fei Lee, Fu-Cheng Chang | 2020-10-13 |
| 10699963 | Structure and formation method of semiconductor device structure with isolation feature | Tsung-Han Tsai, Po-Jen Wang, Chun Li Wu | 2020-06-30 |
| 10658455 | Metal insulator metal capacitor structure having high capacitance | Chen-Yin Hsu, Chun Li Wu | 2020-05-19 |
| 10566361 | Wide channel gate structure and method of forming | Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Chia-Pin Cheng, Kuo-Cheng Lee +2 more | 2020-02-18 |
| 10483153 | Deep trench isolation structure in semiconductor device | Yu-Hua Yen, Po-Jen Wang, Tsung-Han Tsai | 2019-11-19 |
| 10170515 | Implantation process for semiconductor device | Che-Chun Lu, Fu-Cheng Chang, Chia-Pin Cheng, Po-Chun Chiu | 2019-01-01 |
| 10157941 | Image sensor and fabrication method thereof | Chia-Pin Cheng, Fu-Cheng Chang, Che-Chun Lu | 2018-12-18 |
| 10157950 | Pixel with spacer layer covering photodiode | Kuo-Hung Lee, Chia-Pin Cheng, Fu-Cheng Chang, Volume Chien | 2018-12-18 |
| 10115758 | Isolation structure for reducing crosstalk between pixels and fabrication method thereof | Kai-Yi Chen, Chih-Fei Lee, Fu-Cheng Chang, Chia-Pin Cheng | 2018-10-30 |
| 10020265 | Semiconductor structure and fabricating method thereof | Kuo-Hung Lee, Chih-Fei Lee, Fu-Cheng Chang | 2018-07-10 |
| 9997628 | Semiconductor device and method of fabricating thereof | Hsin-Hsiang Tseng, Jheng-Hong Jiang, Fu-Cheng Chang, Hsin-Chi Chen | 2018-06-12 |
| 9887225 | Pixel with spacer layer covering photodiode | Kuo-Hung Lee, Chia-Pin Cheng, Fu-Cheng Chang, Volume Chien | 2018-02-06 |
| 9859328 | Method of manufacturing a metal-oxide-semiconductor image sensor | — | 2018-01-02 |
| 9666473 | Manufacturing method of semiconductor device | — | 2017-05-30 |
| 9543190 | Method of fabricating semiconductor device having a trench structure penetrating a buried layer | — | 2017-01-10 |
| 9537040 | Complementary metal-oxide-semiconductor image sensor and manufacturing method thereof | — | 2017-01-03 |
| 9406710 | Semiconductor device and manufacturing method of the same | — | 2016-08-02 |
| 9312292 | Back side illumination image sensor and manufacturing method thereof | — | 2016-04-12 |
| 9093296 | LDMOS transistor having trench structures extending to a buried layer | — | 2015-07-28 |
| 9054106 | Semiconductor structure and method for manufacturing the same | — | 2015-06-09 |
| 8921901 | Stacked CMOS image sensor and signal processor wafer structure | — | 2014-12-30 |
| 8779344 | Image sensor including a deep trench isolation (DTI)that does not contact a connecting element physically | — | 2014-07-15 |
| 8779539 | Image sensor and method for fabricating the same | Hsin-Ping Wu | 2014-07-15 |