Issued Patents All Time
Showing 51–61 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6797190 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Art Yu, Shih-Hsun Hsu, Hsueh-Chung Chen | 2004-09-28 |
| 6709544 | Chemical mechanical polishing equipment | Shao-Chung Hu, Hsueh-Chung Chen, Shih-Hsun Hsu | 2004-03-23 |
| 6706140 | Control system for in-situ feeding back a polish profile | Shao-Chung Hu, Teng-Chun Tsai | 2004-03-16 |
| 6696361 | Post-CMP removal of surface contaminants from silicon wafer | Shao-Chung Hu, Teng-Chun Tsai, Yung-Tsung Wei | 2004-02-24 |
| 6660627 | Method for planarization of wafers with high selectivities | Shao-Chung Hu, Hsueh-Chung Chen, Shih-Hsun Hsu | 2003-12-09 |
| 6638830 | Method for fabricating a high-density capacitor | Teng-Chun Tsai, Yi-Fang Cheng | 2003-10-28 |
| 6638391 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same | Art Yu, Shih-Hsun Hsu, Hsueh-Chung Chen | 2003-10-28 |
| 6616510 | Chemical mechanical polishing method for copper | Teng-Chun Tsai, Yung-Tsung Wei, Ming-Sheng Yang | 2003-09-09 |
| 6593185 | Method of forming embedded capacitor structure applied to logic integrated circuit | Teng-Chun Tsai, Yi-Fang Cheng, Yi-Hsiung Lin | 2003-07-15 |
| 6455432 | Method for removing carbon-rich particles adhered on a copper surface | Teng-Chun Tsai, Yung-Tsung Wei, Ming-Sheng Yang | 2002-09-24 |
| 5435942 | Process for treating alkaline wastes for vitrification | — | 1995-07-25 |