Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8304864 | Lead frame routed chip pads for semiconductor packages | Anang Subagio, Shafidul Islam | 2012-11-06 |
| 8236612 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Michael H. McKerreghan, Anang Subagio, Allan C. Toriaga | 2012-08-07 |
| 8084300 | RF shielding for a singulated laminate semiconductor device package | Michael H. McKerreghan, Anang Subagio, Allan C. Toriaga, Lenny Christina Gultom | 2011-12-27 |
| 8058104 | Reversible leadless package and methods of making and using same | Shafidul Islam | 2011-11-15 |
| 8053869 | Package having exposed integrated circuit device | Michael H. McKerreghan, Shafidul Islam | 2011-11-08 |
| 8022512 | No lead package with heat spreader | Mary Jean Bajacan Ramos, Anang Subagio | 2011-09-20 |
| 7943431 | Leadless semiconductor package and method of manufacture | Anang Subagio | 2011-05-17 |
| 7820480 | Lead frame routed chip pads for semiconductor packages | Shafidul Islam, Anang Subagio | 2010-10-26 |
| 7816186 | Method for making QFN package with power and ground rings | Anang Subagio | 2010-10-19 |
| 7799611 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Mary Jean Bajacan Ramos, Anang Subagio | 2010-09-21 |
| 7795710 | Lead frame routed chip pads for semiconductor packages | Shafidul Islam, Anang Subagio | 2010-09-14 |
| 7790500 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Mary Jean Bajacan Ramos, Anang Subagio, Lynn Simporios Guirit | 2010-09-07 |
| 7741158 | Method of making thermally enhanced substrate-base package | Timothy Leung, Mary Jean Bajacan Ramos, Gan Kian Yeow, Kyaw Ko Lwin, Anang Subagio | 2010-06-22 |
| 7709935 | Reversible leadless package and methods of making and using same | Shafidul Islam | 2010-05-04 |
| 7700414 | Method of making flip-chip package with underfill | Anang Subagio, Glenn Macaraeg, Mary Jean Bajacan Ramos | 2010-04-20 |
| 7622332 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Shafidul Islam | 2009-11-24 |
| 7563648 | Semiconductor device package and method for manufacturing same | Shafidul Islam, Daniel Lau, Anang Subagio, Michael H. McKerreghan, Edmunda G-O. Litilit | 2009-07-21 |
| 7554180 | Package having exposed integrated circuit device | Michael H. McKerreghan, Shafidul Islam | 2009-06-30 |
| 7439097 | Taped lead frames and methods of making and using the same in semiconductor packaging | Shafidul Islam, Lenny Christina Gultom | 2008-10-21 |
| 7262491 | Die pad for semiconductor packages and methods of making and using same | Shafidul Islam, Anang Subagio | 2007-08-28 |
| 7129116 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Shafidul Islam | 2006-10-31 |
| 6812552 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Shafidul Islam | 2004-11-02 |
| 6777265 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Shafidul Islam | 2004-08-17 |