Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8304864 | Lead frame routed chip pads for semiconductor packages | Romarico Santos San Antonio, Anang Subagio | 2012-11-06 |
| 8058104 | Reversible leadless package and methods of making and using same | Romarico Santos San Antonio | 2011-11-15 |
| 8053869 | Package having exposed integrated circuit device | Michael H. McKerreghan, Romarico Santos San Antonio | 2011-11-08 |
| 7820480 | Lead frame routed chip pads for semiconductor packages | Romarico Santos San Antonio, Anang Subagio | 2010-10-26 |
| 7795710 | Lead frame routed chip pads for semiconductor packages | Romarico Santos San Antonio, Anang Subagio | 2010-09-14 |
| 7709935 | Reversible leadless package and methods of making and using same | Romarico Santos San Antonio | 2010-05-04 |
| 7622332 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Romarico Santos San Antonio | 2009-11-24 |
| 7563648 | Semiconductor device package and method for manufacturing same | Daniel Lau, Romarico Santos San Antonio, Anang Subagio, Michael H. McKerreghan, Edmunda G-O. Litilit | 2009-07-21 |
| 7554180 | Package having exposed integrated circuit device | Michael H. McKerreghan, Romarico Santos San Antonio | 2009-06-30 |
| 7439097 | Taped lead frames and methods of making and using the same in semiconductor packaging | Romarico Santos San Antonio, Lenny Christina Gultom | 2008-10-21 |
| 7262491 | Die pad for semiconductor packages and methods of making and using same | Romarico Santos San Antonio, Anang Subagio | 2007-08-28 |
| 7129116 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Romarico Santos San Antonio | 2006-10-31 |
| 6812552 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Romarico Santos San Antonio | 2004-11-02 |
| 6777265 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Romarico Santos San Antonio | 2004-08-17 |
| 4812114 | New IC molding process | James Kennon, Jeffrey L. Popken, Jerry B. Medders, Susan S. Fitzgerald, Donald R. Kelley +1 more | 1989-03-14 |