Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022512 | No lead package with heat spreader | Romarico Santos San Antonio, Anang Subagio | 2011-09-20 |
| 7799611 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Romarico Santos San Antonio, Anang Subagio | 2010-09-21 |
| 7790500 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging | Anang Subagio, Lynn Simporios Guirit, Romarico Santos San Antonio | 2010-09-07 |
| 7741158 | Method of making thermally enhanced substrate-base package | Timothy Leung, Gan Kian Yeow, Kyaw Ko Lwin, Romarico Santos San Antonio, Anang Subagio | 2010-06-22 |